W631GG6KB-12 IC DRAM 1GBIT PARALLEL 96WBGA Winbond Electronics

Brand Name Winbond Electronics
Model Number W631GG6KB-12
Minimum Order Quantity 1
Price Based on current price
Packaging Details anti-static bag & cardboard box
Delivery Time 3-5 work days
Payment Terms T/T
Supply Ability In stock

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Product Details
Memory Type Volatile Memory Format DRAM
Technology SDRAM - DDR3 Memory Size 1Gbit
Memory Organization 64M X 16 Memory Interface Parallel
Clock Frequency 800 MHz Write Cycle Time - Word, Page -
Access Time 20 Ns Voltage - Supply 1.425V ~ 1.575V
Operating Temperature 0°C ~ 85°C (TC) Mounting Type Surface Mount
Package / Case 96-TFBGA Supplier Device Package 96-WBGA (9x13)
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Part Number Description
Product Description

Product Details

 

GENERAL DESCRIPTION

The W631GG6KB is a 1G bits DDR3 SDRAM, organized as 8,388,608 words x 8 banks x 16 bits. This device achieves high speed transfer rates up to 1866 Mb/sec/pin (DDR3-1866) for various applications. W631GG6KB is sorted into the following speed grades: -11, -12, 12I, 12A, 12K -15, 15I, 15A and 15K. The -11 speed grade is compliant to the DDR3-1866 (13-13-13) specification. The -12, 12I, 12A and 12K speed grades are compliant to the DDR3-1600 (11-11-11) specification (the 12I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C). The -15, 15I, 15A and 15K speed grades are compliant to the DDR3-1333 (9-9-9) specification (the 15I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C).

 

 

FEATURES

 Power Supply: VDD, VDDQ = 1.5V ± 0.075V
 Double Data Rate architecture: two data transfers per clock cycle
 Eight internal banks for concurrent operation
 8 bit prefetch architecture
 CAS Latency: 6, 7, 8, 9, 10, 11 and 13
 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable On The-Fly (OTF)
 Programmable read burst ordering: interleaved or nibble sequential
 Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received with data
 Edge-aligned with read data and center-aligned with write data
 DLL aligns DQ and DQS transitions with clock
 Differential clock inputs (CK and CK#)
 Commands entered on each positive CK edge, data and data mask are referenced to both edges of a differential data strobe pair (double data rate)
 Posted CAS with programmable additive latency (AL = 0, CL - 1 and CL - 2) for improved command, address and data bus efficiency
 Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
 Auto-precharge operation for read and write bursts
 Refresh, Self-Refresh, Auto Self-refresh (ASR) and Partial array self refresh (PASR)
 Precharged Power Down and Active Power Down

 

Specifications

Attribute Attribute Value
Manufacturer Winbond Electronics
Product Category Memory ICs
Categories Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Manufacturer Hirose Electric Co Ltd
Series IT1
Packaging Tray
Part-Status Active
Connector-Type Module, Center Strip Contacts
Number-of-Positions 252 Positions
Pitch 0.020" (0.50mm)
Number-of-Rows 2 Rows
Mounting-Type -
Features Double Sided
Contact-Finish Gold
Contact-Finish-Thickness -
Mated-Stacking-Heights -
Height-Above-Board -

Descriptions

SDRAM - DDR3 Memory IC 1Gb (64M x 16) Parallel 800MHz 20ns 96-WBGA (9x13)
DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96-Pin WBGA