IS43R16160F-6BLI IC DRAM 256MBIT PAR 60TFBGA ISSI, Integrated Silicon Solution Inc

Brand Name ISSI, Integrated Silicon Solution Inc
Model Number IS43R16160F-6BLI
Minimum Order Quantity 1
Price Based on current price
Packaging Details anti-static bag & cardboard box
Delivery Time 3-5 work days
Payment Terms T/T
Supply Ability In stock

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Product Details
Memory Type Volatile Memory Format DRAM
Technology SDRAM - DDR Memory Size 256Mbit
Memory Organization 16M X 16 Memory Interface Parallel
Clock Frequency 166 MHz Write Cycle Time - Word, Page 15ns
Access Time 700 Ps Voltage - Supply 2.3V ~ 2.7V
Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount
Package / Case 60-TFBGA Supplier Device Package 60-TFBGA (8x13)
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IS46R16320D-6BLA1 IC DRAM 512MBIT PAR 60TFBGA
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IS46R16320D-5BLA1 IC DRAM 512MBIT PAR 60TFBGA
IS46R16320D-6BLA2-TR IC DRAM 512MBIT PAR 60TFBGA
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Part Number Description
Product Description

Product Details

 

FEATURES

• Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V
• Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V
- Backward compatible to 1.5V
• High speed data transfer rates with system frequency up to 933 MHz
• 8 internal banks for concurrent operation
• 8n-Bit pre-fetch architecture
• Programmable CAS Latency
• Programmable Additive Latency: 0, CL-1,CL-2
• Programmable CAS WRITE latency (CWL) based on tCK
• Programmable Burst Length: 4 and 8
• Programmable Burst Sequence: Sequential or Interleave
• BL switch on the fly
• Auto Self Refresh(ASR)
• Self Refresh Temperature(SRT)
• Refresh Interval:
7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C
3.9 us (8192 cycles/32 ms) Tc= 85°C to 105°C
• Partial Array Self Refresh
• Asynchronous RESET pin
• TDQS (Termination Data Strobe) supported (x8 only)
• OCD (Off-Chip Driver Impedance Adjustment)
• Dynamic ODT (On-Die Termination)
• Driver strength : RZQ/7, RZQ/6 (RZQ = 240 Ω)
• Write Leveling
• Up to 200 MHz in DLL off mode
• Operating temperature:
Commercial (TC = 0°C to +95°C)
Industrial (TC = -40°C to +95°C)
Automotive, A1 (TC = -40°C to +95°C)
Automotive, A2 (TC = -40°C to +105°C)

 

Specifications

Attribute Attribute Value
Manufacturer ISSI
Product Category Memory ICs
Series -
Packaging Tray Alternate Packaging
Package-Case 60-TFBGA
Operating-Temperature -40°C ~ 85°C (TA)
Interface Parallel
Voltage-Supply 2.3 V ~ 2.7 V
Supplier-Device-Package 60-TFBGA (8x13)
Memory Capacity 256M (16M x 16)
Memory-Type DDR SDRAM
Speed 166MHz
Format-Memory RAM

Descriptions

SDRAM - DDR Memory IC 256Mb (16M x 16) Parallel 166MHz 700ps 60-TFBGA (8x13)
DRAM Chip DDR SDRAM 256Mbit 16Mx16 2.5V 60-Pin TFBGA
DRAM 256M, 2.5V, DDR, 16Mx16, 166MHz