W25Q128JVCIQ TR IC FLASH 128MBIT SPI 24TFBGA Winbond Electronics

Brand Name Winbond Electronics
Model Number W25Q128JVCIQ TR
Minimum Order Quantity 1
Price Based on current price
Packaging Details anti-static bag & cardboard box
Delivery Time 3-5 work days
Payment Terms T/T
Supply Ability In stock

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Product Details
Memory Type Non-Volatile Memory Format FLASH
Technology FLASH - NOR Memory Size 128Mbit
Memory Organization 16M X 8 Memory Interface SPI - Quad I/O, QPI, DTR
Clock Frequency 133 MHz Write Cycle Time - Word, Page 3ms
Access Time - Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount
Package / Case 24-TBGA Supplier Device Package 24-TFBGA (6x8)
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Part Number Description
Product Description

Product Details

 

GENERAL DESCRIPTION

The W25Q128BV (8M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down.

 

 

FEATURES

• Family of SpiFlash Memories
– W25Q128BV: 128M-bit/16M-byte
– 256-byte per programmable page
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
• Highest Performance Serial Flash
– 104/70MHz Dual Output/Quad SPI clocks
– 208/280MHz equivalent Dual /Quad SPI
– 35MB/S continuous data transfer rate
– Up to 5X that of ordinary Serial Flash
– More than 100,000 erase/program cycles(1)
– More than 20-year data retention
• Efficient “Continuous Read Mode”
– Low Instruction overhead
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
• Low Power, Wide Temperature Range
– Single 2.7 to 3.6V supply
– 4mA active current, <1µA Power-down current
– -40°C to +85°C operating range
• Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program one to 256 bytes
– Erase/Program Suspend & Resume
• Advanced Security Features
– Software and Hardware Write-Protect
– Top/Bottom, 4KB complement array protection
– Lock-Down and OTP array protection
– 64-Bit Unique Serial Number for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Byte Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
• Space Efficient Packaging
– 8-pad WSON 8x6-mm
– 16-pin SOIC 300-mil
– 24-ball TFBGA 8x6-mm
– Contact Winbond for KGD and other options

 

Specifications

Attribute Attribute Value
Manufacturer Winbond Electronics
Product Category Memory ICs
Series SpiFlash®
Packaging Tape & Reel (TR) Alternate Packaging
Package-Case 24-TBGA
Operating-Temperature -40°C ~ 85°C (TA)
Interface SPI Serial
Voltage-Supply 2.7 V ~ 3.6 V
Supplier-Device-Package 24-TFBGA (6x8)
Memory Capacity 128M (16M x 8)
Memory-Type FLASH - NOR
Speed 104MHz
Format-Memory FLASH

Descriptions

FLASH - NOR Memory IC 128Mb (16M x 8) SPI - Quad I/O 133MHz 24-TFBGA (6x8)
SPIFLASH, 128M-BIT, DTR, 4KB U