W9464G6KH-5 IC DRAM 64MBIT PAR 66TSOP II Winbond Electronics

Brand Name Winbond Electronics
Model Number W9464G6KH-5
Minimum Order Quantity 1
Price Based on current price
Packaging Details anti-static bag & cardboard box
Delivery Time 3-5 work days
Payment Terms T/T
Supply Ability In stock

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Product Details
Memory Type Volatile Memory Format DRAM
Technology SDRAM - DDR Memory Size 64Mbit
Memory Organization 4M X 16 Memory Interface Parallel
Clock Frequency 200 MHz Write Cycle Time - Word, Page 15ns
Access Time 55 Ns Voltage - Supply 2.3V ~ 2.7V
Operating Temperature 0°C ~ 70°C (TA) Mounting Type Surface Mount
Package / Case 66-TSSOP (0.400", 10.16mm Width) Supplier Device Package 66-TSOP II
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Part Number Description
Product Description

Product Details

 

GENERAL DESCRIPTION

W9425G6DH is a CMOS Double Data Rate synchronous dynamic random access memory (DDR SDRAM), organized as 4,194,304 words × 4 banks × 16 bits. Using pipelined architecture and 0.11 µm process technology, W9425G6DH delivers a data bandwidth of up to 500M words per second (-4). To fully comply with the personal computer industrial standard, W9425G6DH is sorted into four speed grades: -4, -5, -6 and -75. The -4 is compliant to the DDR500/CL3 specification. The -5 is compliant to the DDR400/CL3 specification. The -6 is compliant to the DDR333/CL2.5 specification (the -6I grade which is guaranteed to support -40°C ~ 85°C). The -75 is compliant to the DDR266/CL2 specification (the 75I grade which is guaranteed to support -40°C ~ 85°C).

 

 

FEATURES

• 2.5V ±0.2V Power Supply for DDR266/DDR333
• 2.6V ±0.1V Power Supply for DDR400/DDR500
• Up to 250 MHz Clock Frequency
• Double Data Rate architecture; two data transfers per clock cycle
• Differential clock inputs (CLK and CLK )
• DQS is edge-aligned with data for Read; center-aligned with data for Write
• CAS Latency: 2, 2.5 and 3
• Burst Length: 2, 4 and 8
• Auto Refresh and Self Refresh
• Precharged Power Down and Active Power Down
• Write Data Mask
• Write Latency = 1
• 7.8µS refresh interval (8K / 64 mS refresh)
• Maximum burst refresh cycle: 8
• Interface: SSTL_2
• Packaged in TSOP II 66-pin, 400 mil, 0.65 mm pin pitch, using Pb free with RoHS compliant

 

Specifications

Attribute Attribute Value
Manufacturer Winbond Electronics
Product Category Memory ICs
Series -
Packaging Tray Alternate Packaging
Package-Case 66-TSSOP (0.400", 10.16mm Width)
Operating-Temperature 0°C ~ 70°C (TA)
Interface Parallel
Voltage-Supply 2.3 V ~ 2.7 V
Supplier-Device-Package 66-TSOP II
Memory Capacity 64M (4M x 16)
Memory-Type DDR SDRAM
Speed 200MHz
Format-Memory RAM

Descriptions

SDRAM - DDR Memory IC 64Mb (4M x 16) Parallel 200MHz 55ns 66-TSOP II
DRAM Chip DDR SDRAM 64Mbit 4Mx16 2.5V 66-Pin TSOP-II