IS43R32400E-5BL-TR IC DRAM 128MBIT PAR 144LFBGA ISSI, Integrated Silicon Solution Inc

Brand Name ISSI, Integrated Silicon Solution Inc
Model Number IS43R32400E-5BL-TR
Minimum Order Quantity 1
Price Based on current price
Packaging Details anti-static bag & cardboard box
Delivery Time 3-5 work days
Payment Terms T/T
Supply Ability In stock

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Product Details
Memory Type Volatile Memory Format DRAM
Technology SDRAM - DDR Memory Size 128Mbit
Memory Organization 4M X 32 Memory Interface Parallel
Clock Frequency 200 MHz Write Cycle Time - Word, Page 15ns
Access Time 700 Ps Voltage - Supply 2.3V ~ 2.7V
Operating Temperature 0°C ~ 70°C (TA) Mounting Type Surface Mount
Package / Case 144-LFBGA Supplier Device Package 144-LFBGA (12x12)
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Part Number Description
Product Description

Product Details

 

FEATURES

● Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V
● Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V
- Backward compatible to 1.5V
● High speed data transfer rates with system
frequency up to 933 MHz
● 8 internal banks for concurrent operation
● 8n-bit pre-fetch architecture
● Programmable CAS Latency
● Programmable Additive Latency: 0, CL-1,CL-2
● Programmable CAS WRITE latency (CWL) based on tCK
● Programmable Burst Length: 4 and 8
● Programmable Burst Sequence: Sequential or Interleave
● BL switch on the fly
● Auto Self Refresh(ASR)
● Self Refresh Temperature(SRT)
● Refresh Interval:
7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C
3.9 us (8192 cycles/32 ms) Tc= 85°C to 105°C
● Partial Array Self Refresh
● Asynchronous RESET pin
● TDQS (Termination Data Strobe) supported (x8 only)
● OCD (Off-Chip Driver Impedance Adjustment)
● Dynamic ODT (On-Die Termination)
● Driver strength : RZQ/7, RZQ/6 (RZQ = 240  )
● Write Leveling
● Up to 200 MHz on DLL off mode
● Operating temperature:
Commercial (TC = 0°C to +95°C)
Industrial (TC = -40°C to +95°C)
Automotive, A1 (TC = -40°C to +95°C)
Automotive, A2 (TC = -40°C to +105°C)

 

Specifications

Attribute Attribute Value
Manufacturer ISSI
Product Category Memory ICs
Series IS43R32400E
Type DDR1
Packaging Tape & Reel (TR) Alternate Packaging
Mounting-Style SMD/SMT
Package-Case 144-LFBGA
Operating-Temperature 0°C ~ 70°C (TA)
Interface Parallel
Voltage-Supply 2.3 V ~ 2.7 V
Supplier-Device-Package 144-LFBGA (12x12)
Memory Capacity 128M (4M x 32)
Memory-Type DDR SDRAM
Speed 200MHz
Access-Time 5 ns
Format-Memory RAM
Maximum Operating Temperature + 70 C
Operating temperature range 0 C
Organization 4 M x 32
Supply-Current-Max 320 mA
Data-Bus-Width 32 bit
Supply-Voltage-Max 2.7 V
Supply-Voltage-Min 2.3 V
Package-Case LFBGA-144
Maximum-Clock-Frequency 200 MHz

Descriptions

SDRAM - DDR Memory IC 128Mb (4M x 32) Parallel 200MHz 700ps 144-LFBGA (12x12)
DRAM Chip DDR SDRAM 128Mbit 4Mx32 2.5V 144-Pin LFBGA T/R
DRAM 128M (4Mx32) 200MHz DDR 2.5v